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13 times cooler means what, divide by 13? So the CPU is at 30 Kelvin?

Can’t say I fully grasp the concept, but it seems like these ‘transistors’ are a replacement for traditional TIM and solder?

You just put a layer of them between the die and IHS and… magic happens?!

Sounds like a great way to cool-down 3D stacked dies.

We already have the original IEEE article posted, no need for the dumbed down Tom’s Hardware version with a nonsense title.