imaginary_num6er@alien.topB to Hardware@hardware.watchEnglish · 1 year agoSK Hynix and Nvidia reportedly working on a radical GPU redesign that 3D-stacks HBM memory directly on top of the processing coreswww.tomshardware.comexternal-linkmessage-square18fedilinkarrow-up13arrow-down10
arrow-up13arrow-down1external-linkSK Hynix and Nvidia reportedly working on a radical GPU redesign that 3D-stacks HBM memory directly on top of the processing coreswww.tomshardware.comimaginary_num6er@alien.topB to Hardware@hardware.watchEnglish · 1 year agomessage-square18fedilink
minus-squaremonocasa@alien.topBlinkfedilinkEnglisharrow-up1·1 year agoHeat. The processor generates most of the heat, so you want the back side of the die somewhere a heat spreader can more or less directly connect to.
Heat. The processor generates most of the heat, so you want the back side of the die somewhere a heat spreader can more or less directly connect to.