The manufacturing method for Ryzen chiplet & Epyc are basically identical, with a different IOD and packaging complexity being the only real differences, so any additional production costs predominantly down to that part instead of something related to the wafer.
Yield/binning costs cancels themselves out because a CCD, the single most expensive part to design and manufacture, has all of its costs spread across the entire Epyc & Ryzen chiplet product stack. Intel doesn’t have that luxury, since Xeon & Core-S are two different sets of designs.
Ryzen APUs are a fundamentally different design to all the other Ryzen/Epyc stack. So even if the mobile chips command a higher ASP than Ryzen chiplet, they also carry with them a higher manufacturing cost because it isn’t subsidised by being part of the CCD production line.
From what source? Laptop chips have always enjoyed higher margins than desktops. Not as much as their server line, but still.
That’s only explicitly true for Intel.
The manufacturing method for Ryzen chiplet & Epyc are basically identical, with a different IOD and packaging complexity being the only real differences, so any additional production costs predominantly down to that part instead of something related to the wafer.
Yield/binning costs cancels themselves out because a CCD, the single most expensive part to design and manufacture, has all of its costs spread across the entire Epyc & Ryzen chiplet product stack. Intel doesn’t have that luxury, since Xeon & Core-S are two different sets of designs.
Ryzen APUs are a fundamentally different design to all the other Ryzen/Epyc stack. So even if the mobile chips command a higher ASP than Ryzen chiplet, they also carry with them a higher manufacturing cost because it isn’t subsidised by being part of the CCD production line.